OMAPL138EZWT3 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OMAPL138EZWT3
Manufacturer

TI
ChipWorker Part#

CW5666160
Category

Microprocessor IC
Package

LFBGA-361
Description

DSP Fixed-Point/Floating-Point 32Bit 375MHz 3648MIPS 361Pin NFBGA
Documentation

Datasheet

OMAPL138EZWT3 Global Supplier

{{ supplierTable.supplier }}	{{ supplierTable.part }}	{{ supplierTable.availability }}	MOQ	{{ supplierTable.delivery_date }}

{{viewMore}}
{{viewMore}}
DigiKey	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
Arrow	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
Mouser	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
					{{submitRFQ}}

OMAPL138EZWT3 Specifications

Attribute	Attribute Value

Part Number	OMAPL138EZWT3
Manufacturer	TI
ChipWorker Part#	CW5666160
Category	Microprocessor IC
Documentation	Datasheet
Number of Pins	361 Pin
Case/Package	LFBGA-361
Frequency	300 MHz
Number of Positions	361 Position
Clock Speed	375 MHz
RAM Memory Size	328 KB
Number of UARTs	3 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage (Max)	1.32 V
Supply Voltage (Min)	1.14 V
	expand all
Size-Length	13 mm
Size-Width	13 mm
Size-Height	0.94 mm
Operating Temperature	0℃ ~ 90℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	3A991.a.2

Product Description

Description
The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.
OMAP-L138 C6000 DSP+ARM Processor
Features
• Dual-Core SoC
– 375- and 456-MHz ARM926EJ-S™ RISC MPU
– 375- and 456-MHz C674x Fixed- and Floating Point VLIW DSP
• ARM926EJ-S Core
– 32- and 16-Bit ( Thumb®) Instructions
– DSP Instruction Extensions
– Single-Cycle MAC
– ARM Jazelle® Technology
– Embedded ICE-RT™ for Real-Time Debug
• ARM9™ Memory Architecture
– 16KB of Instruction Cache
– 16KB of Data Cache
– 8KB of RAM (Vector Table)
– 64KB of ROM
• C674x Instruction Set Features
– Superset of the C67x+ and C64x+ ISAs
– Up to 3648 MIPS and 2746 MFLOPS
– Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– Compact 16-Bit Instructions
• C674x Two-Level Cache Memory Architecture
– 32KB of L1P Program RAM/Cache
– 32KB of L1D Data RAM/Cache
– 256KB of L2 Unified Mapped RAM/Cache
– Flexible RAM/Cache Partition (L1 and L2)
• Enhanced Direct Memory Access Controller 3(EDMA3):
– 2 Channel Controllers
– 3 Transfer Controllers
– 64 Independent DMA Channels
– 16 Quick DMA Channels
– Programmable Transfer Burst Size
• TMS320C674x Floating-Point VLIW DSP Core
– Load-Store Architecture with Nonaligned Support
– 64 General-Purpose Registers (32-Bit)
– Six ALU (32- and 40-Bit) Functional Units
• Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
• Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
• Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
– Two Multiply Functional Units:
• Mixed-Precision IEEE Floating-Point Multiply Supported up to:
– 2 SP x SP → SP Per Clock
– 2 SP x SP → DP Every Two Clocks
– 2 SP x DP → DP Every Three Clocks
– 2 DP x DP → DP Every Four Clocks
• Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Hardware Support for Modulo Loop Operation
– Protected Mode Operation
– Exceptions Support for Error Detection and Program Redirection
Software Support
– TI DSP BIOS™
– Chip Support Library and DSP Library
128KB of RAM Shared Memory
1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
Two External Memory Interfaces:
– EMIFA
• NOR (8- or 16-Bit-Wide Data)
• NAND (8- or 16-Bit-Wide Data)
• 16-Bit SDRAM with 128-MB Address Space
– DDR2/Mobile DDR Memory Controller with one of the following:
• 16-Bit DDR2 SDRAM with 256-MB Address Space
Applications
• Professional or Private Mobile Radio (PMR)
• Remote Radio Unit (RRU)
• Remote Radio Head (RRH)
• Industrial Automation
• Currency Inspection
• Biometric Identification
• Machine Vision (Low-End)
• Smart Grid Substation Protection
• Industrial Portable Navigation Devices

expand all

Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
- You can check the status of your order in the “My Order” section of your personal account.
- Orders cannot be canceled after the package has been shipped. View more >
- Works with both individual and corporate clients. View more >
- All prices on the website include 20% VAT.
- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

Contact Us

Buy OMAPL138EZWT3

Stock is limited and changes quickly. Our 24/7 online sales team is ready to respond to your inquiries and orders at any time.