TLK3134ZEL - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TLK3134ZEL
Manufacturer

TI
ChipWorker Part#

CW28609534
Category

Interface IC, Interface Controller
Package

BGA-289
Description

Ethernet TXRX Single Chip 4Port 1.2V/1.5V/1.8V/2.5V 30Gbps 289Pin BGA Tray
Documentation

Datasheet

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TLK3134ZEL Specifications

Attribute	Attribute Value

Part Number	TLK3134ZEL
Manufacturer	TI
ChipWorker Part#	CW28609534
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	289 Pin
Case/Package	BGA-289
Supply Voltage (DC)	1.20 V
Number of Channels	4 Channel
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	1.14V ~ 1.26V
	expand all
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	5A991.b.1

Product Description

Description
The TLK3134 is a flexible four-channel independently configurable serial transceiver. It can be configured
to be compliant with the 10Gbps Ethernet XAUI specification. It can also be configured to be compliant
with the 1000Base-X 1Gbps Ethernet Specification (Auto-Negotiation not supported). The TLK3134
provides high-speed bidirectional point-to-point data transmissions with up to 30 Gbps of raw data
transmission capacity. The primary application of this device is in backplanes and front panel connections
requiring 10Gbps connections over controlled impedance media of approximately 50Ω. The transmission
media can be printed circuit board (PCB) traces, copper cables or fiber-optical media.
Introduction
Features
• Four-Channel 600Mbps to 3.75Gbps Multi-Rate Transceiver
• Supports 10GbE (XAUI), 1X/2X/10X Fibre Channel (FC), CPRI (x1/x2/x4), OBSAI (x1/x2/x4), and 1GbE (1000Base-X) Data Rates
• Complete IEEE Compliant 10 GbE XGXS (XAUI) Compliant Core and 1000Base-X PCS Support
• Supports Independent Channel SERDES Operation Modes in 8/10 Bit Data Modes (TBI and 8 Bit + Control)
• Serial Side Transmit De-Emphasis and Receive Adaptive Equalization to Allow Extended
Backplane Reach
• Low Jitter LC Oscillator Jitter-Cleaner Allows use of Poor Quality REFCLK
• Full Datapath Loopback Capability (Serial/Parallel Side)
• Support PRBS 27-1 and 223- 1 Gen/Verify. Support standard defined CJPAT, CRPAT, High and Low Frequency, and Mixed Freq Testing.
• XGMII/GMII/RGMII: HSTL Class 1 I/O With On-Chip 50Ω Termination on Inputs/Outputs (1.5/1.8 V Power Supply)
• XGMII/GMII/RGMII: Source And Data Centered I/O Timing Modes
• Supports Jumbo Packet (9600 byte maximum) Operation.
• XAUI Align Character Skew Support of 30 Bit Times at Chip Pins
• MDIO: IEEE 802.3ae Clause 22 and Clause 45 Compliant Management Data Input / Output Interface Modes (Either 1.2 V or 2.5 V MDIO I/O)
• 1.2 V Core, 1.5 V/1.8 V HSTL I/O Supply, and 2.5 V LVCMOS I/O Supply
• JTAG: IEEE 1149.1/1149.6 Test Interface
• ±200 ppm Clock Tolerance in XAUI TX and 1000Base-X/XAUI RX Datapaths
• 90 nm Advanced CMOS Technology
• Package: PBGA, 19×19mm, 289 Ball, 1mm Pitch
• 1.3W Maximum Power Dissipation (1.5 V HSTL XAUI Mode, Input HSTL Termination Disabled)
• Asymmetric RX/TX Rates Supported in Independent Channel Modes
• Industrial Ambient Operating Temperature (–40°C to 85°C) at Full Rate
Applications
• Gigabit Ethernet links
• CPRI/OBSAI Links
• Point-to-Point High-Speed Backplane Links

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- Anti-vibration foam
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- Electrical testing
- Surface testing

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