B82498F1102J - Epcos

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

B82498F1102J
Manufacturer

Epcos
ChipWorker Part#

CW89445377
Category

Inductor
Package

0805
Description

Inductor Chip Molded Wirewound 1uH 5% 7.96MHz 20Q-Factor Ferrite 240mA 550mOhm DCR 0805 Automotive T/R
Documentation

Datasheet

B82498F1102J Global Supplier

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B82498F1102J Specifications

Attribute	Attribute Value

Part Number	B82498F1102J
Manufacturer	Epcos
ChipWorker Part#	CW89445377
Category	Inductor
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	2 Pin
Case/Package (SI)	2012
Case/Package	0805
Current Rating	240 mA
Capacitance Tolerance	±5 %
Inductance	1 µH
Self Resonant Frequency	440 MHz
Q-Factor	20.0
Resistance	500 mΩ
Resonant Frequency	350 MHz
Shielding	No
Inductance Tolerance	±5 %
Test Frequency	7.96 MHz
DC Resistance (DCR)	≤550 mΩ
Current Rating (DC)	240 mA
Resistance (DC Max)	0.55 Ω
	expand all
Size-Length	2.3 mm
Size-Width	1.7 mm
Size-Height	1.4 mm
Operating Temperature	-55℃ ~ 125℃
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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