BSP75N - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BSP75N
Manufacturer

Infineon
ChipWorker Part#

CW1110263
Category

FET Driver
Package

SOT-223-4
Description

Power Switch Lo Side 1Out 0.7A 0.49Ω Automotive 4Pin(3+Tab) SOT-223
Documentation

Datasheet

BSP75N Global Supplier

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BSP75N Specifications

Attribute	Attribute Value

Part Number	BSP75N
Manufacturer	Infineon
ChipWorker Part#	CW1110263
Category	FET Driver
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	4 Pin
Case/Package	SOT-223-4
Supply Voltage (DC)	0.00V(min), 10.0V(max)
Power Rating	1.8 W
Number of Outputs	1 Output
Output Current	700 mA
Number of Channels	1 Channel
Number of Positions	4 Position
Power Dissipation	1.8 W
Input Voltage (Max)	10 V
Output Current (Max)	700 mA
Number of Inputs	1 Input
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	1800 mW
Supply Voltage	2.5V ~ 10V
Supply Voltage (Max)	10 V
Supply Voltage (Min)	0.2 V
Input Voltage	10 V
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Size-Length	6.5 mm
Size-Width	3.5 mm
Size-Height	1.6 mm
Operating Temperature	-40℃ ~ 150℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The BSP75N is a N-channel low-side vertical power FET Switch in smart SIPMOS® technology and fully protected by embedded protection functions. It has thermal shutdown with auto restart and also logic Level Input.
Input protection (ESD)
Overload protection
Short-circuit protection
Overvoltage protection
Current limitation
Analogue driving possible
ESD sensitive device, take proper precaution while handling the device.

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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