HMC536LP2 - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC536LP2
Manufacturer

ADI
ChipWorker Part#

CW50081676
Package

DFN-6
Description

RF Switch SPDT 0MHz to 6GHz 23dB 6Pin DFN EP T/R
Documentation

Datasheet

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HMC536LP2 Specifications

Attribute	Attribute Value

Part Number	HMC536LP2
Manufacturer	ADI
ChipWorker Part#	CW50081676
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	DFN-6
Frequency	6000 MHz
Power Dissipation	860 mW
Test Frequency	6 GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	860 mW
Supply Voltage	5 V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	Non-Compliant
Lead-Free Status	Contains Lead
ECCN Code	EAR99

Product Description

Product Details
The HMC536LP2(E) is a DC to 6 GHz GaAs MMIC T/R switch in leadless 2x2 mm DFN LP2 surface mount packages with an exposed ground paddle. The switch is ideal for cellular, WiMAX, & WiBro access point and subscriber applications featuring low 0.6 dB insertion loss and high +54 dBm input IP3. Power handling is excellent up through 6 GHz with the switch offering a P0.1dB compression point of +29 dBm at +3V and +33 dBm at +5V control. On-chip circuitry allows positive voltage control of 0/+3V or 0/+5V at very low DC currents. The HMC536LP2(E) occupies only 4 mm² and are ideal for applications where small size is required.
Applications
Cellular/PCS/3G Infrastructure
WiMAX, WiBro & Fixed Wireless
CATV/CMTS
Test Instrumentation
### Features and Benefits
Input P0.1dB: +33 dBm @ +5V
Insertion Loss: 0.6 dB
Positive Control: +3V or +5V
Isolation: 27 dB
2x2 mm Leadless DFN
SMT Package, 4 mm²

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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