HMC575LP4E - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC575LP4E
Manufacturer

ADI
ChipWorker Part#

CW3023680
Category

Amplifier chip
Package

QFN-24
Description

Active RF Multipliers x2 3GHz to 4.5GHz 6GHz to 9GHz 24Pin QFN EP T/R
Documentation

Datasheet

HMC575LP4E Global Supplier

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HMC575LP4E Specifications

Attribute	Attribute Value

Part Number	HMC575LP4E
Manufacturer	ADI
ChipWorker Part#	CW3023680
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	24 Pin
Case/Package	QFN-24
Frequency	6GHz ~ 9GHz
Supply Voltage (DC)	4.50V (min)
Number of Positions	24 Position
Power Dissipation	512 mW
Output Power	17 dBm
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	512 mW
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Size-Length	4.1 mm
Size-Width	4.1 mm
Size-Height	1 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
Mil-Spec	Yes
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The HMC575LP4E is a x2 active broadband Frequency Multiplier utilizing GaAs PHEMT technology. When driven by a 3dBm signal, the multiplier provides +17dBm typical output power from 6 to 9GHz. The Fo and 3Fo isolations are 15dBc with respect to output signal level. This frequency multiplier features DC blocked I/O"s and is ideal for use in LO multiplier chains for Pt to Pt and VSAT radios yielding reduced parts count vs. traditional approaches. The low additive SSB phase noise of -140dBc/Hz at 100kHz offset helps maintain good system noise performance. The HMC575LP4(E) is compatible with surface mount manufacturing techniques.
-2 to +6dBm Low input power drive
15dBc Fo, 3Fo Isolation
5V at 90mA Single supply

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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