OPB710 - TT Electronics/Optek Technology

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OPB710
Manufacturer

TT Electronics/Optek Technology
ChipWorker Part#

CW39778263
Category

Photoelectric Sensor
Package

TO-72
Description

Sensor; Reflective; Phototransistor; 3V Emitter; 30V Detector; 0.25W(1/4W); 25mA
Documentation

Datasheet

OPB710 Global Supplier

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OPB710 Specifications

Attribute	Attribute Value

Part Number	OPB710
Manufacturer	TT Electronics/Optek Technology
ChipWorker Part#	CW39778263
Category	Photoelectric Sensor
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	2 Pin
Case/Package	TO-72
Supply Voltage (DC)	5.00 V
Voltage Rating (DC)	30.0 V
Operating Voltage	5.00 V
Output Voltage	30.0 V
Forward Voltage	1.5 V
Wavelength	935 nm
Input Current	50.0 mA
Peak Wavelength	935 nm
Power Dissipation	150 mW
Breakdown Voltage (Collector to Emitter)	30 V
Forward Current	50 mA
Forward Current (Max)	50 mA
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Power Dissipation (Max)	150 mW
Supply Voltage	1.5 V
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Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The OPB710 is a Reflective Object Sensor that consists of a gallium arsenide infrared emitting diode and an NPN silicon phototransistor. On each sensor, the emitting diode and detector are mounted side-by-side on parallel axes. A black plastic sleeve is attached and filled with encapsulating epoxy to cover the emitter and detector. The package contains an internal barrier which prevents diode emissions from reaching the sensor directly.
Photodarlington output
Unfocused for sensing diffuse surface
Clear encapsulating epoxy
Filtered to reduce the effect of visible or fluorescent light

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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