SMCJ130A - Littelfuse

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SMCJ130A
Manufacturer

Littelfuse
ChipWorker Part#

CW3889757
Category

TVS Diode
Package

DO-214AB
Description

DIODE TVS 130V 1500W UNI 5% SMC
Documentation

Datasheet

SMCJ130A Global Supplier

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SMCJ130A Specifications

Attribute	Attribute Value

Part Number	SMCJ130A
Manufacturer	Littelfuse
ChipWorker Part#	CW3889757
Category	TVS Diode
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	2 Pin
Case/Package	DO-214AB
Voltage Rating (DC)	130 V
Power Rating	1.50 kW
Breakdown Voltage	151.5 V
Number of Circuits	1 Circuit
Number of Positions	2 Position
Power Dissipation	1.5 kW
Clamping Voltage	209 V
Test Current	1 mA
Max Breakdown Voltage	159 V
Peak Pulse Power	1500 W
Min Breakdown Voltage	144 V
Reverse Breakdown Voltage	144 V
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-65 ℃
Junction Temperature	-65℃ ~ 150℃
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Size-Length	8.13 mm
Size-Width	6.22 mm
Size-Height	2.62 mm
Operating Temperature	-55℃ ~ 150℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

FEATURES
• RoHS compliant
• For surface mounted applications in order to optimize board space
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Repetition Rate(duty cycle): 0.05%
• Fast response time: typically less than 1.0ps from 0 Volts to BV min.
• Typical IR less than 1mA above 10V
• High temperature soldering: 250˚C/10 seconds at terminals
• Plastic package has Underwriters Laboratory Flammability 94V-O

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- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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