TMS320F28235PGFA - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320F28235PGFA
Manufacturer

TI
ChipWorker Part#

CW4896300
Category

Microcontroller, MCU IC
Package

LQFP-176
Description

MCU 32Bit C2000 C28x RISC 512KB Flash 1.9V/3.3V 176Pin LQFP Tray
Documentation

Datasheet

TMS320F28235PGFA Global Supplier

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TMS320F28235PGFA Specifications

Attribute	Attribute Value

Part Number	TMS320F28235PGFA
Manufacturer	TI
ChipWorker Part#	CW4896300
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	176 Pin
Case/Package	LQFP-176
Frequency	150 MHz
Supply Voltage (DC)	1.80V (min)
Number of Positions	176 Position
Clock Speed	150 MHz
RAM Memory Size	34K x 16
FLASH Memory Size	512 KB
Number of UARTs	3 UART
Number of ADCs	1 ADC
Number of Inputs and Outputs	88 Input IO
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.995 V
Supply Voltage (Min)	1.805 V
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Size-Height	1.45 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

Description
The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/ Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.
Features
• High-Performance Static CMOS Technology
– Up to 150 MHz (6.67-ns Cycle Time)
– 1.9-V/1.8-V Core, 3.3-V I/O Design
• High-Performance 32-Bit CPU (TMS320C28x)
– IEEE 754 Single-Precision Floating-Point Unit (FPU) (F2833x Only)
– 16 × 16 and 32 × 32 MAC Operations
– 16 × 16 Dual MAC
– Harvard Bus Architecture
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– Code-Efficient (in C/C++ and Assembly)
• Six-Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
• 16-Bit or 32-Bit External Interface (XINTF)
– More Than 2M × 16 Address Reach
• On-Chip Memory
– F28335, F28333, F28235: 256K × 16 Flash, 34K × 16 SARAM
– F28334, F28234: 128K × 16 Flash, 34K × 16 SARAM
– F28332, F28232: 64K × 16 Flash, 26K × 16 SARAM
– 1K × 16 OTP ROM
• Boot ROM (8K × 16)
– With Software Boot Modes (Through SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
– Standard Math Tables
• Clock and System Control
– On-Chip Oscillator
– Watchdog Timer Module
• GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
• Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
• 128-Bit Security Key/Lock
– Protects Flash/OTP/RAM Blocks
– Prevents Firmware Reverse Engineering
• Enhanced Control Peripherals
– Up to 18 PWM Outputs
– Up to 6 HRPWM Outputs With 150 ps MEP Resolution
– Up to 6 Event Capture Inputs
– Up to 2 Quadrature Encoder Interfaces
– Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs)
– Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs)
• Three 32-Bit CPU Timers
• Serial Port Peripherals
– Up to 2 CAN Modules
– Up to 3 SCI (UART) Modules
– Up to 2 McBSP Modules (Configurable as SPI)
– One SPI Module
– One Inter-Integrated Circuit (I2C) Bus
• 12-Bit ADC, 16 Channels
– 80-ns Conversion Rate
– 2 × 8 Channel Input Multiplexer
– Two Sample-and-Hold
– Single/Simultaneous Conversions
– Internal or External Reference
• Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
• JTAG Boundary Scan Support
– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug Using Hardware
• Development Support Includes
– ANSI C/C++ Compiler/Assembler/Linker
– Code Composer Studio™ IDE
– DSP/BIOS™ and SYS/BIOS
– Digital Motor Control and Digital Power Software Libraries
• Low-Power Modes and Power Savings
– IDLE, STANDBY, HALT Modes Supported
– Disable Individual Peripheral Clocks
• Endianness: Little Endian
• Package Options:
– Lead-free, Green Packaging
– Plastic Ball Grid Array (BGA) (ZJZ)
– MicroStar BGA™ (ZHH)
– Low-Profile Quad Flatpack (LQFP) (PGF)
– Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
• Temperature Options:
– A: –40°C to 85°C (PGF, ZHH, ZJZ)
– S: –40°C to 125°C (PTP, ZJZ)
– Q: –40°C to 125°C (PTP, ZJZ)
(AEC Q100 Qualification for Automotive Applications)
Applications
• Industrial AC Inverter Drives
• Industrial Servo Amplifiers and Controllers
• Computer Numerical Control (CNC) Machining
• Uninterruptible and Server Power Supplies
• Telecom Equipment Power
• Solar Inverters

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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