TPS65951A1ZGU - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TPS65951A1ZGU
Manufacturer

TI
ChipWorker Part#

CW54768076
Category

Power Management IC
Package

BGA-169
Description

Power Management Unit 2.7V to 4.5V 169Pin BGA MICROSTAR Bulk
Documentation

Datasheet

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TPS65951A1ZGU Specifications

Attribute	Attribute Value

Part Number	TPS65951A1ZGU
Manufacturer	TI
ChipWorker Part#	CW54768076
Category	Power Management IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	12 Pin
Case/Package	BGA-169
Supply Voltage (DC)	5.00 V
Number of Positions	12 Position
Number of Regulated Outputs	12 Output
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	5 V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2014/12/17
ECCN Code	5A991.g

Product Description

Introduction
The TPS65951 device is a power-management IC for mobile cellular handsets powered by a Li-ion, Li-ion polymer, or cobalt-nickel-manganese cell battery. It can be connected to an application processor and/or a modem. This optimized power-management IC is designed to support the specific power requirements of the OMAP processor devices. The TPS65951 contains several buck converters, low dropout (LDO) regulators, battery charger interface, and a host of other features and functions. The audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers/amplifiers, and class D output amplifiers.
This TPS65951 Data Manual presents the electrical and mechanical specifications for the TPS65951 device. It covers the following topics:
• A description of the TPS65951 terminals: assignment, multiplexing, electrical characteristics, and functional description (see Section 2)
• A presentation of the electrical characteristic requirements: maximum and recommended operating conditions, digital I/O characteristics (see Section 3)
• The clock specifications: clock slicer, input and output clocks (see Section 4)
• The audio/voice module with the electrical characteristics and the application schematics for the downlink and uplink path (see Section 5)
• The power module including the power provider, power references, power control, the power consumption, and the power management with the sequence on and off (see Section 6)
• The timing requirements and switching characteristics (ac timings) of the interfaces (see Section 7)
• The battery charger interface (see Section 8)
• A description of different modules: MADC and LED drivers (see Section 9 and Section 10)
• The deboucing time (see Section 11)
• A description of the external components for the application schematics (see Section 12)
• The thermal resistance characteristics, device nomenclature, and mechanical data about the available packaging (see Section 13)
• 1 A glossary of acronyms and abbreviations used in this data manual (see Section 14)

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